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Precision Bonding & Smart Selection: Tunsing DS6193 and DS6194 Polyurethane Hot Melt Adhesive Films

2026-08-26
Latest company news about Precision Bonding & Smart Selection: Tunsing DS6193 and DS6194 Polyurethane Hot Melt Adhesive Films

Precision Bonding & Smart Selection: A Comparison and Model Selection Guide for Tunsing DS6193 and DS6194 Polyurethane Hot Melt Adhesive Films

In composite processing sectors such as apparel, footwear, bags, electronics accessories, and sporting goods, selecting a hot melt adhesive film with matching technical properties is critical to enhancing product quality and manufacturing efficiency. Shenzhen Tunsing Plastic Products Co., Ltd. offers two premium polyurethane (PU) hot melt adhesive films—DS6193 and DS6194—both demonstrating excellent adhesion to textiles, TPU, PVC, PC, and ABS, along with superior cold resistance.

However, to accommodate different processing equipment conditions and melt viscosity requirements, the two products differ in their rheological behaviors and activation parameters. Based on official Technical Data Sheets (TDS), this article provides a detailed technical comparison to help you choose the ideal model for your application.

1. Quick Technical Comparison

Specification / Parameter DS6193 PDF DS6194 PDF Key Takeaways & Differences
Composition

Polyurethane

Polyurethane

Both offer excellent flexibility and cold resistance.

Density / Proportion

$1.18 \pm 0.02\text{ g/cm}^3$

$1.20 \pm 0.02\text{ g/cm}^3$

Virtually identical density.

Hardness (Shore A)

$96 \pm 3$

$96 \pm 3$

Identical hardness; similar tactile feel in finished goods.

Melt Flow Index (MFI)

$16 \pm 5\text{ cm}^3/10\text{ min}$

$3 \pm 2\text{ cm}^3/10\text{ min}$

DS6193 offers higher fluidity; DS6194 features low flow / anti-overflow properties.

Glass Transition Temp. (Tg)

Approx. $-54.1^\circ\text{C}$

$-45 \pm 8^\circ\text{C}$

Both provide outstanding low-temperature / cold resistance.

Viscoelastic Transition Temp.

$54.2^\circ\text{C}$

$97.1^\circ\text{C}$

DS6194 transition temperature is significantly higher than DS6193.

Activation Temperature

$68 - 137^\circ\text{C}$

$90 - 150^\circ\text{C}$

DS6193 has a lower activation point, ideal for low-temp, rapid processing.

1st Lamination Mold Temp.

$130 - 170^\circ\text{C}$

$130 - 180^\circ\text{C}$

Compatible with most standard thermal pressing equipment.

Available Dimensions

Thickness: 0.05 / 0.08 mm


Width: 1380 mm

Thickness: 0.03 - 0.15 mm (Standard: 0.05/0.08/0.10 mm)


Width: 5 - 1480 mm

DS6194 offers a broader range of custom thicknesses and narrow slit widths.

2. Deep Dive into Key Performance Differences

1. Fluidity and Anti-Overflow Performance (MFI & Rheology)

  • DS6193 (High MFI / Fast Melting): Features a high Melt Flow Index of $16 \pm 5\text{ cm}^3/10\text{ min}$ and transitions from a viscoelastic solid to a liquid at $54.2^\circ\text{C}$. When heated, the film melts rapidly and penetrates deep into textiles or porous substrates to form a strong mechanical lock.

  • DS6194 (Low MFI / Anti-Overflow): Features a low Melt Flow Index of $3 \pm 2\text{ cm}^3/10\text{ min}$ and a higher viscoelastic transition temperature of $97.1^\circ\text{C}$. During heat pressing, it retains high melt viscosity, effectively preventing glue squeeze-out along edges or bleed-through, making it ideal for precision bonding applications requiring clean edges.

2. Processing Temperature & Thermal Stability

  • DS6193 operates within an activation range of $68 - 137^\circ\text{C}$. Its lower melting threshold helps shorten cycle times, reduce energy consumption, and minimize thermal damage to heat-sensitive materials.

  • DS6194 operates within $90 - 150^\circ\text{C}$. It maintains better melt strength at higher pressing temperatures (e.g., $180^\circ\text{C}$), preserving structural integrity during processing.

3. Model Selection & Application Recommendations

To streamline your manufacturing decisions, choose the model that best matches your operational requirements:

Recommended Applications for DS6193:

  1. High Efficiency & Energy Saving: Ideal for assembly lines requiring low activation temperatures (starting as low as $68^\circ\text{C}$) to speed up lamination and cycle times.

  2. Porous Substrates & Deep Penetration: Its high fluidity enables better anchorage into coarse textiles, embroidery backings, or porous materials to achieve high peel strength.

  3. Standard High-Volume Production: Commonly applied in standard clothing, footwear, hats, toys, and luggage bonding with regular 0.05 mm or 0.08 mm thickness needs.

Recommended Applications for DS6194:

  1. Anti-Bleed & Clean Edge Requirements: Excellent for thin textiles, light-colored fabrics, electronic components, or exposed edges where adhesive squeeze-out must be avoided.

  2. Multi-Layer or Secondary Heat Pressing: Its high transition temperature ($97.1^\circ\text{C}$) prevents adhesive layer displacement or re-flow during subsequent heating cycles.

  3. Custom Sizes & Non-Standard Thicknesses: When ultra-thin ($0.03\text{ mm}$), thicker gauge ($0.10 - 0.15\text{ mm}$), or narrow slit widths ($5 - 1480\text{ mm}$) are required, DS6194 provides greater customization flexibility.

Conclusion

Both Tunsing DS6193 and DS6194 represent industry-grade quality in polyurethane hot melt adhesive films. If your process prioritizes high penetration, fast melting, and lower energy usage, DS6193 offers an efficient solution. If your application demands anti-overflow control, edge precision, and extensive custom sizing, DS6194 provides superior stability. Preliminary sample testing under actual manufacturing conditions is recommended to finalize optimal lamination settings.